Abrasion of the brass nozzle happens quite often when printing PolyMide™ CoPA. A wear-resistant nozzle, such as hardened steel and ruby nozzle, is highly recommended to be used with PolyMide™ CoPA.
PolyMide™ CoPA is sensitive to moisture and should always be stored and used under dry conditions (relative humidity below 20%).
If PolyMide™ CoPA is used as the support material for itself, please remove the support structure before excessive moisture absorption. Otherwise, the support structure can be permanently bonded to the model.
After the printing process, it is recommended to anneal the model in the oven at 80°C for 6 hours.
Printing Parameters
Nozzle Temperature
250 – 270°C
Build Surface Material
PA film, PI film
Build Surface Treatment
Glue
Build Plate Temperature
25 - 50°C
Cooling Fan
OFF
Printing Speed
30-60 mm/s
Raft Separation Distance
0.2 mm
Retraction Distance
3 mm
Retraction Speed
40 mm/s
Environmental Temperature
40 - 60°C
Threshold Overhang Angle
55°
Recommended Support Material
PolyDissolve™ S1
Disclaimer
The typical values presented in this data sheet are intended for reference and comparison purposes only. They should not be used for design specifications or quality control purposes. Actual values may vary significantly with printing conditions. End-use performance of printed parts depends not only on materials, but also on part design, environmental conditions, printing conditions, etc. Product specifications are subject to change without notice.
Each user is responsible for determining the safety, lawfulness, technical suitability, and disposal/recycling practices of Rev1Tech materials for the intended application. Rev1Tech makes no warranty of any kind, unless announced separately, to the fitness for any use or application. Rev1Tech shall not be made liable for any damage, injury, or loss induced from the use of Rev1Tech materials in any application.
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