RF System Lab NAOMi-CT 3D-M
Industrial X-Ray Computed Tomography Scanner
The RF System Lab NAOMi-CT 3D-M is a self-shielded benchtop industrial X-ray CT scanner for non-destructive volumetric inspection of small-to-mid samples up to a Φ250 × H230 mm envelope and 10 kg in weight. A 100 kV / 10 mA micro-focus X-ray source paired with a 2.0 MP amorphous-Si flat-panel detector at 98 µm pixel pitch resolves down to an 80 µm reconstructed voxel — small enough to image porosity, hairline cracks, fiber orientation, and fine inclusion structure inside aluminum die-castings, plastic injection moldings, electronics assemblies, and composite parts. Each scan completes in approximately 45 seconds. The cabinet is FDA-classified self-shielded under 21 CFR 1020.40 — no X-ray room build-out, no licensed operator, no facility shielding plan. Sold and supported in the United States by Rev1 Technologies of Auburn Hills, Michigan. Full specifications →
Rev1 validates application fit, sample requirements, facility power, and shielding before purchase. Industrial X-ray CT is an application decision — we help you confirm fit before quote.
A self-shielded benchtop CT scanner for in-house NDT — at roughly 1/8 the cost of a metrology CT.
The NAOMi-CT 3D-M is the entry-tier scanner in the RF System Lab industrial CT line, engineered to put computed-tomography inspection capability inside a small QA lab, R&D bench, or production-line audit cell — without the facility build-out, licensed-operator overhead, or six-figure capital cost of traditional metrology CT systems. The 100 kV / 10 mA source pairs with a 2.0 MP amorphous-Si flat-panel detector to resolve 80 µm features inside aluminum die-castings, plastic injection moldings, electronics assemblies, food packaging, and composite lay-ups. Each scan completes in roughly 45 seconds. The cabinet is self-shielded to FDA 21 CFR 1020.40 — operate it on a standard factory floor or QA bench, no X-ray room required.
100 kV / 10 mA micro-focus source with 0.5 mm focal spot.
A 100 kV / 10 mA micro-focus tube delivers enough penetrating power for aluminum up to ~10 mm thick, polymers and composites at any thickness, electronics assemblies, food packaging, and biological specimens. The 0.5 mm focal spot, combined with the geometric magnification provided by the rotation stage, supports the 80 µm reconstructed voxel target. Above 100 kV the production-QA value drops sharply — thicker steel or denser ceramics need a higher-kV system, but those are rare in the sample classes the 3D-M targets. Oil and air cooling keep the tube stable across continuous duty.
Send Rev1 your sample geometry, density, and target defect size. We will help validate whether the NAOMi-CT 3D-M's 100kV / 10mA source has the penetrating power for your inspection workflow before you quote.
A detector calibrated to the 80 µm voxel target across the full Φ250 envelope.
The flat-panel detector is the second half of the resolution equation. The 3D-M ships with a 1440 × 1440 (2.0 MP) amorphous-Si FPD at 98 µm pixel pitch and 14-bit dynamic range — matched to the source geometry so that fine features survive reconstruction with usable contrast at the 80 µm voxel target.
The detector and source are tuned to each other. Pixel pitch, dynamic range, and active area are sized for the 3D-M's sample class — aluminum HPDC, plastics, electronics, food packaging — so the reconstruction holds up under production inspection cadence.
Φ250 × H230 mm scan envelope. Up to 10 kg samples.
A 250 mm diameter by 230 mm height scan envelope holds the vast majority of aluminum die-castings, plastic injection moldings, electronics assemblies, and composite samples in their native geometry — no cutting, no fixturing tricks, no multi-scan stitching for a single part. Sample weight is bounded at 10 kg by the rotation stage; for parts at or near that limit, fixturing should distribute load evenly.
The sample stage carries the part through a controlled rotation while the source-to-detector distance is set via Z-lift to dial in the geometric magnification — trading scan diameter for voxel size as needed for the inspection job. Positioning repeatability holds at ~10 µm so that scan-to-scan comparisons across a production lot stay meaningful.
Aluminum die-cast porosity. Plastic injection voids. Electronics assembly verification.
These are the application classes the 3D-M was engineered around. For samples outside this band — thicker steel castings, dense ceramic components, large industrial assemblies — Rev1 will help size the right CT system, including a step up to the larger NAOMi-CT 3D-L or to a higher-kV vendor when the application requires it.
Filtered back projection, iterative reconstruction, defect quantification, CAD bridge.
The bundled NAOMi-CT software handles end-to-end acquisition, FBP and iterative reconstruction, multi-planar reformat (MPR), volume rendering, automated porosity and void quantification with CSV/report export, and surface extraction to STL or STEP for downstream CAD compare and dimensional metrology in VGSTUDIO MAX, Volume Graphics, or any standard CAD platform. Reconstructed volumes export as DICOM stack, TIFF stack, or VGL.
See the 3D-M find voids and image internal structure.
The hero video below shows the NAOMi-CT detecting voids inside an aluminum casting. The six-tile gallery underneath samples the breadth of materials the 3D-M images in production: aluminum HPDC porosity, plastic injection void analysis, electronics and PCB assembly verification, battery cell internal structure, and food / consumer-product range. All from RF System Lab reference scans — click any tile to play.
Engine Part — Aluminum HPDC
Shrinkage cavity and porosity detection inside die-cast aluminum engine components.
Aluminum Welding Defects
Blowhole and weld-defect inspection on the Asano Co. reference part — internal pore visualization.
Trigger Nozzle — Plastics
Internal flow-defect verification inside an injection-molded plastic nozzle assembly.
PC Mouse — Electronics Composite
Solder joints, ribbon cable routing, and housing fit on a fully assembled consumer electronic.
Battery Cell — Energy Storage
Internal cell structure and terminal seating for EV battery and energy-storage QA workflows.
Bottle & Pump Assembly
Cap-to-body fit and pump seating tolerance inside a sealed plastic dispenser.
Workstation control. DICOM / TIFF / STL / STEP export. Air-gapped operation.
The 3D-M is operated from a dedicated workstation with the vendor reconstruction software pre-installed. Data lives locally — no cloud dependency for sensitive inspection records, no third-party uplink for ITAR / EAR / classified-facility deployments. LAN export to network storage and air-gapped operation are both supported.
Production QA, R&D labs, and inspection cells.
The 3D-M targets in-house production-QA and R&D applications across automotive HPDC, EV components, plastics manufacturing, electronics assembly, additive manufacturing post-process inspection, and university research labs. Self-shielded operation makes deployment practical in environments where a traditional CT room build-out would be cost-prohibitive or compliance-prohibitive.
What the 3D-M is built to scan — and what it is not.
The 100 kV / 10 mA source qualifies the 3D-M for light alloys (aluminum to ~10 mm thick), polymers and composites at any sample-size-bound thickness, electronics assemblies including PCBs and cables, food packaging and contents, and biological specimens. For thicker steel components, dense ceramics, or large industrial assemblies above the Φ250 mm envelope, Rev1 helps size a higher-kV or larger-envelope system — including the intra-brand 3D-L or a vendor in a different class entirely.
NAOMi-CT 3D-M vs. industry benchmarks & intra-brand peers.
We benchmark the 3D-M against the standard metrology-CT punch-up tier (Nikon Metrology XT H 225 ST 2x and ZEISS METROTOM 1500) plus an open-vendor mid-market peer (North Star Imaging X5000), and against the natural intra-brand cross-shop (NAOMi-CT 3D-L). The goal is buyer clarity: where the 3D-M leads on price, deployability, and scan time — and where a different system genuinely fits better.
Send Rev1 your sample geometry, target voxel, and inspection workflow and we will tell you which CT platform actually fits the application — including when a different vendor is the better answer.
RF System Lab NAOMi-CT 3D-M — full specifications.
Documentation, software, and Rev1 support resources.
RF System Lab hardware with Rev1 application support.
An industrial X-ray CT scanner is a multi-year application investment, not just a hardware purchase. Rev1 helps validate the target sample, voxel requirement, source kV class, facility shielding plan, software workflow, and total cost of ownership before the NAOMi-CT 3D-M is deployed in your QA lab or production line.
Confirm whether the NAOMi-CT 3D-M is the right CT platform for the specific sample geometry, defect-size target, throughput requirement, and downstream analysis workflow — or whether a larger / smaller / higher-kV vendor is the better fit.
Plan electrical, footprint, environmental, and shielding compliance for the 100kV source class. Self-shielded means no X-ray room build-out, but facility power and HVAC still need to be sized correctly.
Work with Rev1 for quoting, freight, install support, software training, and practical troubleshooting from Auburn Hills, Michigan — not from a grey-market reseller or unauthorized importer.
Integrate the NAOMi-CT 3D-M output with VGSTUDIO MAX, Volume Graphics, downstream CAD comparison, and your existing QA reporting workflow. Rev1 helps make the data useful, not just acquired.