3DXSTAT ESD-PC • 3DXTECH • REV1 TECH
3DXTech 3DXSTAT™ ESD-PC ESD Polycarbonate — 10^7–10^9 Ω/sq · Standard Nozzle · Made in USA
ESD Polycarbonate — 107–109 Ω/sq · Standard Nozzle · Made in USA
3DXTech’s 3DXSTAT ESD-PC delivers reliable ESD dissipation at 10⁷–10⁹ Ω/sq using carbon nanotube (CNT) technology — meeting ANSI/ESD S4.1 requirements without abrasive fillers. Polycarbonate base resin provides impact toughness and a 143°C glass transition temperature for industrial ESD tooling and packaging applications. Standard brass nozzle compatible. Made in Grand Rapids, Michigan.
750g in stock. Contact Rev1 to confirm availability.
WHY 3DXSTAT ESD-PC
107–109 Ω/sq ESD Dissipation. PC Toughness. Standard Nozzle.
3DXSTAT™ ESD-PC is 3DXTech’s carbon nanotube ESD polycarbonate filament — engineered to meet ANSI/ESD S4.1 surface resistance requirements (10⁷–10⁹ Ω/sq) while preserving the mechanical toughness of PC. CNT additive delivers consistent, uniform ESD dissipation without abrasive fillers. Standard brass nozzle compatible. 143°C glass transition temperature for demanding ESD tooling environments. Natural color black — standard for ESD-identified components.
107–109 Ω/sq ESD Dissipation
Carbon nanotube ESD additive delivers surface resistance of 10⁷–10⁹ Ω/sq — the ANSI/ESD S4.1 dissipative range. Protects ESD-sensitive components from charge buildup and discharge events during handling, assembly, and storage.
No Abrasive Fillers — Standard Nozzle
CNT technology achieves ESD dissipation without glass or carbon fiber reinforcement. Standard brass nozzle ≥0.4mm is compatible — no hardened nozzle upgrade required. Lower barrier to entry than abrasive ESD grades.
PC Base Toughness & 143°C Tg
Polycarbonate base resin provides impact resistance and a 143°C glass transition temperature for ESD tooling that must survive industrial process environments. Suited for trays, fixtures, and enclosures requiring sustained ESD performance above room temperature.
Made in USA
Extruded and wound in-house at 3DXTech’s Grand Rapids, MI facility under ISO 9001:2015 certification. Consistent CNT loading for repeatable ESD performance across lots. Black color — standard identification for ESD components.
PRINTING WITH 3DXSTAT ESD-PC
ESD-PC — CNT Polycarbonate, Standard Platform Compatible
3DXSTAT ESD-PC prints similarly to standard polycarbonate — 260–300°C extrusion with a heated bed. No hardened nozzle required. An enclosure improves part quality and adhesion consistency. Dry at 80°C before every session.
- Extruder Temp 260–300°C — all-metal hot end recommended; standard hot end (250°C rated) may limit upper range
- Bed Temp 110–130°C — PEI or garolite build surface preferred; PC adhesion is sensitive to surface prep
- Chamber Temp 45–60°C recommended — enclosure reduces warping and improves layer adhesion for larger parts
- Nozzle Standard brass ≥0.4mm — CNT is not abrasive; hardened nozzle not required
- Drying 80°C / 4 hr minimum before every print session
- ⚠ Moisture Warning Polycarbonate is hygroscopic. Wet filament causes splay, bubbling, and weak layer adhesion — signs are audible popping during extrusion. Dry at 80°C / 4 hr before every session and print from a sealed dry-box for best results.
THERMAL DATA
143°C Tg — PC Thermal Performance for Industrial ESD Tooling
Four thermal milestones defining 3DXSTAT™ ESD-PC’s operating envelope — verified against 3DXTech 3DXSTAT ESD-PC TDS v3.
Glass transition temperature of the PC matrix. ESD tooling, trays, and fixtures can be used in environments up to ~110°C continuous service. Tg is significantly higher than PLA/PETG ESD grades, enabling industrial process environments.
HDT at 0.45 MPa. Parts maintain structural integrity under moderate load up to 135°C — suitable for ESD trays in reflow oven loading zones, wave soldering fixtures, and industrial conveyor applications.
Estimated continuous-use service temperature for load-bearing applications. Above PLA/PETG ESD grades by a significant margin. Suitable for industrial process environments where PETG-based ESD materials are marginal.
Required before every session. PC is hygroscopic — moisture causes splay, bubbling, and reduced mechanical properties. Drying at 80°C for 4 hours is sufficient; higher temperatures risk annealing the spool.
ESD PROPERTIES
107–109 Ω/sq — ANSI/ESD S4.1 Dissipative Range
3DXSTAT™ ESD-PC delivers surface resistance in the ANSI/ESD S4.1 electrostatic dissipative range (10⁷–10⁹ Ω/sq). CNT additive provides consistent, uniform ESD dissipation across the part surface — unlike carbon fiber which creates directional conductivity. Protective of ESD-sensitive components (microelectronics, PCBs, MEMS devices) during handling, assembly, packaging, and transport.
Surface resistance per ANSI/ESD S4.1. Test printed parts after manufacturing — anisotropic FFF microstructure can affect measured resistance. Consult 3DXTech 3DXSTAT ESD-PC TDS v3 for test methodology. Not suitable for applications requiring electrical insulation.
SPECIFICATIONS
3DXSTAT™ ESD-PC — Full Technical Data
Source: 3DXTech 3DXSTAT ESD-PC TDS v3. ISO-standard test specimens. 1.75mm black filament.
Material Properties
| Polymer | Polycarbonate (PC) + CNT ESD |
| Diameter | 1.75mm |
| Color | Black |
| Glass Transition (Tg) | 143°C |
| HDT (0.45 MPa, ISO 75) | 135°C |
| Continuous Use Temp | ~110°C |
| Surface Resistance | 10⁷–10⁹ Ω/sq (ESD dissipative) |
| ESD Standard | ANSI/ESD S4.1 dissipative range |
| Flame Rating | HB (PC base) |
| Tensile Strength | 68 MPa (ISO 527) |
| Tensile Modulus | 2,400 MPa (ISO 527) |
| Flexural Strength | 98 MPa (ISO 178) |
| Flexural Modulus | 2,300 MPa (ISO 178) |
| Tensile Elongation | 5% |
| Density | 1.21 g/cm³ (ISO 1183) |
Print Parameters
| Extruder Temp | 260–300°C |
| Bed Temp | 110–130°C |
| Chamber Temp | 45–60°C recommended |
| Drying Protocol | 80°C / 4 hr minimum |
| Nozzle | Standard brass ≥0.4mm |
| Hot End Requirement | All-metal recommended (260–300°C) |
Availability
| Spool Sizes (Available) | 750g (in stock) |
| 750g Price | $135 |
| Lead Time | Varies — contact Rev1 to confirm |
| Quality Standard | ISO 9001:2015 Certified |
| Origin | Grand Rapids, MI, USA |
SPOOL SELECTION
750g Available. Black. 1.75mm.
3DXSTAT™ ESD-PC is available in a single spool size: 750g Black (1.75mm). Consistent CNT loading ensures repeatable ESD performance across the spool.
- 1.75mm diameter — Black
- CNT ESD additive — uniform loading
- Ships from stock
PRINT QUALITY
Production-Grade Output on the Right Equipment
3DXSTAT™ ESD-PC produces parts with consistent ESD dissipation across the printed surface. Black color is standard for ESD-identified components in electronics manufacturing environments.
COMPATIBLE PLATFORMS
Requires an Industrial-Grade 3D Printer
3DXSTAT ESD-PC prints at 260–300°C — within reach of many desktop and industrial platforms. No heated enclosure is strictly required but strongly recommended for larger parts. Standard brass nozzle — no hardened steel upgrade needed.
CreatBot F160-PEEK
Purpose-built high-performance platform with dual all-metal hot ends and integrated chamber heating. Validated for ESD-PC and PEEK — Rev1’s top recommendation for demanding material applications.
Rev1 RecommendedCreatBot PEEK-300
300mm build volume, 420°C hot end rating, 200°C heated chamber. Production-oriented platform suitable for ESD-PC at larger part geometries.
Rev1 RecommendedCreatBot F430
Quad-nozzle large-format industrial printer with multi-material capability. Supports ESD-PC plus support materials for complex geometries and dual-extrusion workflows.
Rev1 RecommendedAny Open-Platform Printer
Minimum: 300°C hot end • 130°C heated bed • 45–60°C enclosure recommended • standard brass nozzle ≥0.4mm.
WHERE IT WORKS
Where ESD-Dissipative PC Outperforms Every Other Option
When you need ESD protection in a tough, 143°C Tg material without abrasive fillers — 3DXSTAT ESD-PC delivers. Lower barrier to entry than ESD PEEK grades with no hardened nozzle requirement.
ESD Trays & Carriers
Custom ESD trays, pallets, and carriers for PCB and semiconductor component handling in wave soldering, reflow, and inspection workflows. 135°C HDT handles low-temp solder process environments.
Electronics Assembly Fixtures
PCB assembly jigs, test fixtures, and pick-and-place tooling where charge buildup during automated assembly could damage ESD-sensitive components. CNT ensures consistent surface resistance throughout the part.
Semiconductor Tooling
Wafer handling equipment, process chamber fixtures, and staging components requiring ESD dissipation. 143°C Tg enables use in elevated-temperature semiconductor process environments.
Electronics Packaging
Custom ESD packaging inserts, component dividers, and shipping trays for sensitive microelectronics. Printed geometry flexibility enables rapid customization vs. thermoformed ESD foam inserts.
Inspection & Test Equipment
Test sockets, probe holders, and inspection fixtures requiring ESD-safe surfaces. PC’s impact resistance protects fixtures during repeated handling in production test environments.
Automation & Conveyor Components
Conveyor parts, guide rails, and gripper components on electronics production lines where ESD protection is required to prevent discharge events during component transport.
MATERIAL CARE
Moisture Is the Enemy. A Proper Protocol Eliminates It.
ESD-PC requires consistent drying before printing at 260–300°C. Polycarbonate absorbs moisture readily. Follow this protocol every session to maintain print quality and ESD performance consistency.
Dry Before Every Session
80°C minimum / 4 hours minimum. No exceptions — even a sealed spool benefits from a fresh drying cycle before printing.
Print From the Dryer
For best results, print directly from a heated dry-box or dryer system. Ambient humidity will re-absorb into the filament during extended print runs.
Store Sealed With Desiccant
Return unused filament to an airtight bag or container with fresh desiccant immediately after printing. Long-term storage in original sealed packaging is acceptable.
Recognize Wet Filament Symptoms
Popping or crackling during extrusion, rough surface texture, reduced layer adhesion, and visible bubbling in the melt are signs of moisture contamination. Re-dry and restart.
HOW IT COMPARES
3DXSTAT™ ESD-PC vs. Commonly Evaluated Alternatives
Buyers evaluating 3DXSTAT ESD-PC typically compare against ESD PETG for a lower-temp option, 3DXSTAT ESD-ULTEM for higher-performance ESD, and Stratasys ESD PETG for a platform-locked alternative.
3DXTech / Rev1 Tech
Generic / Various
3DXTech
Stratasys
3DXTECH QUALITY
Manufactured in Michigan. Certified to ISO 9001:2015.
Every spool of 3DXSTAT™ ESD-PC is produced in-house at 3DXTech’s Grand Rapids, MI facility under ISO 9001:2015 certification. Carbon nanotube ESD additive compounded with PC resin for consistent lot-to-lot ESD performance, with full lot traceability throughout filament fabrication.
ISO 9001:2015 Certified
Production under a certified quality management system. Lot traceability and process controls throughout filament fabrication.
Made in Grand Rapids, MI
Filament extruded and wound in-house at 3DXTech’s Michigan facility. Direct factory quality control — not overseas commodity production.
Technical Data Sheet Available
Full processing parameters, mechanical properties, electrical resistance data, and ESD test methodology published in the 3DXSTAT ESD-PC TDS v3. Available for download below.
RESOURCES
Downloads & Technical Support
Everything you need to qualify and print 3DXSTAT™ ESD-PC with confidence. ESD resistance data, processing parameters, and technical support from Rev1.
WHY REV1 TECH
Authorized 3DXTech Reseller. Industrial AM Specialists.
Rev1 Technologies is an authorized 3DXTech reseller headquartered in Auburn Hills, MI, with direct technical expertise in high-performance FFF materials and the printers that run them.
Authorized Reseller
Every spool ships direct from the authorized channel. MAP pricing guaranteed. Single-channel license compliance — not a grey-market distributor.
Platform Expertise
If you need guidance on which platform to match with 3DXSTAT ESD-PC, our team has run them.
Pre-Sales Technical Support
Questions about print settings, printer selection, or qualifying ESD-PC for electronics manufacturing applications? Contact Rev1 before you order — that conversation is free.
FREQUENTLY ASKED
3DXSTAT™ ESD-PC — Buyer & Engineer Questions Answered
What is 3DXSTAT™ ESD-PC?
3DXSTAT™ ESD-PC is 3DXTech’s carbon nanotube (CNT) electrostatic dissipative polycarbonate filament. Available in Black (1.75mm, 750g), it delivers surface resistance of 10⁷–10⁹ Ω/sq — the ANSI/ESD S4.1 dissipative range — combined with PC’s 143°C glass transition temperature and impact toughness. No hardened nozzle required — CNT is non-abrasive.
What temperatures does 3DXSTAT™ ESD-PC require?
3DXSTAT™ ESD-PC requires an extruder temperature of 260–300°C and a bed temperature of 110–130°C. A heated enclosure at 45–60°C is recommended but not required for all platforms. Dry at 80°C for 4 hours minimum before every print session.
Does 3DXSTAT ESD-PC require a hardened steel nozzle?
No. Carbon nanotube additives are not abrasive — unlike carbon fiber or glass fiber filaments. Standard brass nozzle ≥0.4mm is fully compatible. This is a key advantage over abrasive ESD grades (CF-filled) that require hardened steel nozzles and cause faster nozzle wear.
What ESD standard does 3DXSTAT ESD-PC meet?
3DXSTAT ESD-PC is formulated to achieve surface resistance in the ANSI/ESD S4.1 electrostatic dissipative range: 10⁷–10⁹ Ω/sq. This is the standard ESD working surface classification used throughout electronics manufacturing. Test your finished printed parts — FFF microstructure can affect measured resistance. Consult the TDS v3 for test methodology details.
What applications use 3DXSTAT™ ESD-PC?
3DXSTAT ESD-PC is used for ESD trays and carriers for PCB and semiconductor handling, assembly fixtures, test sockets and probe holders, custom electronics packaging inserts, wafer handling equipment, and ESD-safe conveyor and automation components. Any application requiring ESD dissipation in a material with higher temperature performance than PETG.
Why choose ESD-PC over ESD-PETG?
3DXSTAT ESD-PC has a significantly higher glass transition temperature (143°C vs. ~82°C for PETG) and heat deflection temperature (135°C vs. ~65°C). For ESD trays used in reflow oven loading zones, wave soldering environments, or heated semiconductor process areas, PETG-based ESD materials may distort or lose dimensional accuracy. ESD-PC maintains geometry and ESD performance at higher temperatures.
How does 3DXSTAT ESD-PC compare to Stratasys ESD PETG?
Stratasys ESD PETG is platform-locked to Stratasys printers. 3DXSTAT ESD-PC runs on any open-material printer with a 300°C hot end and 130°C bed — no platform lock-in. ESD-PC also has a significantly higher Tg (143°C vs. ~82°C) and HDT (135°C vs. ~65°C), making it suitable for higher-temperature electronics processes where Stratasys ESD PETG would deform.
What spool sizes are available and what is in stock?
3DXSTAT™ ESD-PC is available in one spool size: 750g Black ($135), which ships from stock. No other spool sizes are standard for this SKU. All filament is 1.75mm diameter.